wirebonding packaging memory substrate with soft gold plating

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HongRuiXing (Hubei) Electronics Co.,Ltd.

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wirebonding packaging memory substrate with soft gold plating

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wirebonding packaging memory substrate with soft gold plating

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory,UDP/USB memory products others; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0...

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FR4 SD Card PCB

BT SD Card PCB

FR4 Circuit Board Fabrication

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