Customizable coreless IC Package Substrate with 0.09mm Thickness

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HongRuiXing (Hubei) Electronics Co.,Ltd.

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Customizable coreless IC Package Substrate with 0.09mm Thickness

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Customizable coreless IC Package Substrate with 0.09mm Thickness

Hitachi BT IC Package Substrate production supporting Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconduc...

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Hitachi BT IC Package Substrate

IC Package Substrate Size Customized

Square BT IC Package Substrate

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